AI ASIC chips drive the demand for packaging and carrier boards, Taiwan factories to enter the supply chain
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Update time : 2023-12-13 14:41:57
The recent artificial intelligence (AI) application-specific chips (ASIC) to drive the demand for semiconductor back-end professional packaging and testing, the legal person pointed out that Taiwan factories, including Sun Micron, Kyocera, Nortel, Foxlink, Precision Test, and other companies have gradually cut into the supply chain of the AI ASIC chip related to the packaging and testing, carrier boards, and test interfaces.
U.S. investment agency report analysis, China Taiwan OSAT packaging and testing factories have cut into Nvidia, AMD's AI chip supply chain, as well as technology companies customized AI ASIC chip supply chain, 2024 related performance can be expected.
Among them, at the wafer testing end, JYEC has a high market share in the GPU chip testing field, and has become the main testing partner of American AI chip manufacturers, and it is estimated that from next year onwards at the earliest, the company can gradually release its volume in the field of AI ASIC chip testing. It is expected that the proportion of AI chips in the overall performance of Kyowa Electric Power can be increased to 7%~8% in 2023, and to 10% next year.
In the field of IC carrier boards (substrates), Nanden has started to supply ABF carrier boards to US-based cloud service equipment manufacturers through ASIC design companies in China and Taiwan, indirectly cutting into the international supply chain.
On the test interface side, Foxlink's chairman, Mr. Wang Chia-huang, said recently that more and more vendors will develop AI ASIC chips on their own in 2024, and it is expected that the proportion of related customers will continue to increase, which will become the main force of the company's growth. Foxlink also cut into the advanced packaging CoWoS test interface, the relevant test is underway, and is expected to MEMS probe card next year, such as the beginning of the release of volume.
Precision Test recently pointed out that in 2024 from the AI chip test interface solutions, including GPU, APU, ASIC and other related chips, will contribute to revenue.
Wafer foundry UMC has been working with Huabang Electric, Wise Plains, Sunrise Semiconductor and Cadence to lay out wafer-to-wafer 3D IC projects to accelerate the production of 3D packaging products.
Sunrise Semiconductor, a subsidiary of Sunrise Investment Control, is actively laying out fan-out FOCoS-Bridge packaging technology, which can integrate multiple ASIC small chips as well as HBM memory chips.
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