AI chips produced by TSMC will become "more expensive" in the future due to supply chain capacity upgrades
Views : 203
Update time : 2023-10-13 09:32:17
On September 26, according to Taiwan's "United Daily News", as TSMC's supply chain expands the production capacity of CoWoS advanced packaging, the price increase of these intermediate membranes will eventually push up the cost of AI chips produced by the company.
Due to strong demand for AI products, TSMC is investing billions of dollars to upgrade its packaging capacity. The company announced in July that it would invest $2.89 billion (note: currently about 21.126 billion yuan) to build a new chip packaging plant. The company aims to increase packaging capacity to 30,000 per month by the end of 2024. Note: CoWoS is a technology that stacks multiple chips together. This technology can place these chips on a silicon dielectric film to improve their performance. It is reported that TSMC is purchasing CoWoS machines from equipment factories such as Xin Yun, Wanrun, Hongsu, Ti Sheng, Qunyi, etc. These companies are expected to be the biggest beneficiaries of the growth in demand for TSMC CoWoS products. It is expected to be delivered and installed in the first half of next year. Industry sources revealed that TSMC currently has a monthly production capacity of about 12,000 pieces of CoWoS advanced packaging. After the previous expansion, the original monthly production capacity will be gradually expanded to 15,000 to 20,000 pieces. After that, additional equipment will be stationed in the factory building. TSMC's monthly production capacity will reach more than 25,000 pieces, or even move closer to 30,000 pieces, thereby increasing TSMC's ability to take on AI-related orders. Due to the upgrade of related production capacity, TSMC's AI chips will also usher in price increases. In addition, Taiwanese media pointed out that Nvidia is currently TSMC's largest customer for CoWoS advanced packaging, with orders accounting for 60% of the production capacity. Recently, in response to strong demand for AI computing, Nvidia has expanded its orders, and urgent orders from customers such as Amazon and Broadcom have also begun to emerge. Given the urgent demand for CoWoS advanced packaging capacity from customers, TSMC has once again pursued 30% plant orders for equipment, and requested to complete delivery and installation by the end of the second quarter of next year, and start mass production in the second half of next year.
The LDK220 series of low-dropout linear regulators (LDOs) is a high-performance device designed specifically for low-power consumption and high-precision voltage regulation, widely used in scenarios such as consumer electronics, industrial control, and po
Xilinx Spartan®-7 FPGA Family stands as a defining solution in the mid-range FPGA landscape, blending high performance, energy efficiency, and cost-effectiveness to redefine versatility for industrial, IoT, and consumer electronics applications. Built on
The Altera FLEX series was more than a lineup of FPGAs—it was a blueprint for how programmable logic devices could evolve to meet diverse market needs. The FLEX 8000 laid the architectural groundwork, the FLEX 10K redefined functionality with embedded mem
Among TI standout offerings, the LM4765 and LM4766 are dual-channel amplifiers designed to cater to diverse audio needs—from compact setups to high-fidelity systems. While sharing the same product lineage, these chips differ significantly in power output,
