Apple's first 3nm chip for MacBook Pro is expected to be put into production this year
Views : 114
Update time : 2022-08-23 11:16:36
According to the newson August 22, DIGITIMES reported that TSMC plans to start mass production of 3nm chips later this year for the upcoming MacBook models and other products.
"the back-end company is optimistic about the demand for the upcoming MacBook chip, which will be manufactured using TSMC's 3nm process technology. According to industry sources, the chip will start production later this year." However, until at least the first quarter of 2023, TSMC is unlikely to generate significant revenue from the overall 3nm chip production. This information is consistent with a report in Taiwan's business times last week, which said that TSMC will start producing 3nm chips for Apple by the end of 2022. The report said that Apple's first 3nm chip may be the M2 Pro chip for Mac, and added that the A17 bionic chip in the iPhone 15 Pro Model in will also be a 3nm chip. mark gurman of Bloomberg predicted that the M2 Pro chip would be used in the next generation of 14 inch and 16 inch MacBook Pro models and would replace the current high-end Mac Mini based on Intel chips. Gurman believes that Apple plans to release a number of new Macs in the October event, but it is not clear whether this includes the new macbook pro and mac mini models, or whether Apple will wait to release its first MAC with 3nm chip in 2023. Both Apple M1 series chips and M2 chips adopt TSMC 5nm and its improved technology. The transition to 3nm chips will improve the performance and energy efficiency of MAC and iPhone.
The LDK220 series of low-dropout linear regulators (LDOs) is a high-performance device designed specifically for low-power consumption and high-precision voltage regulation, widely used in scenarios such as consumer electronics, industrial control, and po
Xilinx Spartan®-7 FPGA Family stands as a defining solution in the mid-range FPGA landscape, blending high performance, energy efficiency, and cost-effectiveness to redefine versatility for industrial, IoT, and consumer electronics applications. Built on
The Altera FLEX series was more than a lineup of FPGAs—it was a blueprint for how programmable logic devices could evolve to meet diverse market needs. The FLEX 8000 laid the architectural groundwork, the FLEX 10K redefined functionality with embedded mem
Among TI standout offerings, the LM4765 and LM4766 are dual-channel amplifiers designed to cater to diverse audio needs—from compact setups to high-fidelity systems. While sharing the same product lineage, these chips differ significantly in power output,