Canon Launches New Wafer Measuring Machine MS-001: Higher Accuracy than Photolithography for Improved Production Efficiency
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Update time : 2023-02-24 17:28:48
Feb. 21, - In the field of advanced semiconductors such as logic, memory, and CMOS sensors, manufacturing processes are becoming increasingly complex, and semiconductor component manufacturers need to improve the accuracy of register lithography in order to produce high-precision semiconductor components, and thus the number of alignment measurement points to be measured before exposure is increasing.
If a large number of measurement points are aligned in a semiconductor lithography machine, the measurement itself will be very time-consuming, which will reduce the productivity of the semiconductor lithography machine. For this reason, wafer measurement machines have been introduced in the semiconductor manufacturing field to separate the alignment measurement function from the semiconductor lithography machine to ensure high accuracy and efficiency in production. On February 21, Canon launched "MS-001", a wafer measuring machine for semiconductor manufacturing, which enables high-precision alignment measurement of wafers. The MS-001 is equipped with an alignment oscilloscope with an area sensor that enables multi-pixel measurement and reduces noise during measurement. In addition, the MS-001 can measure multiple types of alignment marks. With the newly developed alignment oscilloscope light source, the new product can provide a wavelength range 1.5 times larger than that measured in semiconductor lithography equipment, enabling alignment measurements at any wavelength desired by the user. As a result, the "MS-001" can achieve higher alignment measurement accuracy than that of measurements in semiconductor lithography equipment. With the application of the new product, Canon says that most of the alignment measurements can be performed uniformly before the wafer is delivered to the semiconductor lithography equipment, reducing the workload of alignment measurement operations in the semiconductor lithography equipment and thus improving the productivity of the semiconductor lithography equipment.
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