EUV lithography machine will no longer be the only choice for manufacturing high-end chips
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Update time : 2022-11-29 13:40:16
Micron announced that it used 1-beta manufacturing process to bypass EUV lithography machine to manufacture DRAM high-performance chip. Test data shows that the chip has significantly improved in energy efficiency and storage density, which are 25% and 30%, respectively. More importantly, the power consumption is significantly reduced by 20%. Now it is in the technical test stage. Once it passes the test, it can be mass produced.
According to US media reports, Zyvex Labs has launched the sub nanometer separation system with the highest resolution in the world, which is also far more accurate than the EUV lithography machine. It can bypass the EUV lithography machine to produce 0.768nm chips. Secondly, TSMC took the lead in establishing the "3D Fabric" alliance with 19 chip giants such as Samsung Memory Book and SK Hynix, with the goal of researching 3D packaging technology to make it reach the mature standard. And the packaging technology has been verified by AMD, which improves the performance of the chip without relying on the EUV lithography machine. TSMC is the "oldest" in the global chip foundry field, with 80 EUV lithographers. Now it is also looking for ways to bypass EUV lithographers, which is the most worrying place for ASML. In addition, Japan's Hiroshima and Canon jointly launched nano imprint lithography technology, which will reduce the cost by about 40% compared with the mainstream EUV lithography machine currently required for high-end chip manufacturing. It is expected to achieve mass production of 5nm chip process in 2025. It is worth noting that the photonic chip, core particle technology, or quantum chip do not need EUV lithography machine. In China, we can find a new way to make high-end chips domestically. Whether it is the 1-beta process of Micron, the 3D packaging technology of TSMC, the nano imprint lithography technology introduced by Canon in Japan, or the technological breakthrough made in China in a different way, all have demonstrated the manufacturing of high-end chips. This also means the beginning of ASML sorrow, and EUV lithography is no longer the only option.
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