Global IC Substrate Market to Grow to $29.6 Billion by 2027
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Update time : 2022-12-26 10:21:09
According to Yole Intelligence, the global advanced IC substrate market is expected to grow from a value of $15.8 billion in 2021 to $29.6 billion by 2027, at a compound annual growth rate (CAGR) of 11%.
Integrated circuit (IC) substrates are primarily driven by advanced packaging (AP), flip chip level package baseband (FC CSP) and FC ball grid arrays (FC BGA) for 5G wireless devices, high performance computing (HPC), graphics processing units (GPU), servers, and the automotive industry. The market value is expected to grow from $12.6 billion in 2021 to $24.3 billion in 2027, at a CAGR of 12%. Substrate-level printed circuit boards (SLPs), primarily used in high-end smartphones, will generate revenues of $3 billion in 2021, growing at a CAGR of 6.7% to $4.3 billion in 2027. Embedded die (ED) in laminate substrates is relatively new to the market, but is growing at a CAGR of 39%, from $142 million in 2021 to $1 billion in 2027. The main substrate technology trends are through the use of semi-additive processes (SAP), modified SAP (mSAP) or advanced mSAP (amsap) ). In recent years, the development of SLP technology has remained stable, while ED technology aims to enable multi-chip embedding for more applications. The Ajinomoto laminate (ABF) substrate market reached approximately $4.8 billion in 2021. The top five players, Ibiden, Unimicron, NYPCB, Shinko, and AT&S, account for nearly 75% of the total ABF substrate market by surface area. kinsus, SEMCO, Access, Daeduck, Toppan, and Kyocera account for the rest of the market.
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