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Highlights and details of the latest round of U.S. semiconductor export controls

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Update time : 2022-10-10 14:24:14
        In an update, the U.S. SWB Bureau of Industry and Security (BIS) has published on its website a new, more comprehensive set of export control regulations that seek to restrict China's ability to acquire advanced computing chips, develop and maintain supercomputers, and manufacture advanced semiconductors.
        Today, according to previous Caixin news, the U.S. SWB Bureau of Industry and Security (BIS) has escalated its unjustified crackdown on China's chip industry again on the so-called grounds of maintaining GJ security, specifically involving nine new rules, including adding certain advanced, high-performance computer chips and computer goods containing such chips to the Commerce Control List, adding new licensing requirements for end-use supercomputer or semiconductor development and production applications in China, adding certain semiconductor manufacturing equipment and related items to the Commerce Control List, and adding new licensing requirements for advanced chip production in China such as logic chips with non-planar transistor structures below 16 nm or NAND flash memory chips with more than 128 layers. and production applications in China, adding certain semiconductor manufacturing equipment and related items to the Commerce Control List, and adding new licensing requirements for advanced chip production facilities in China, such as logic chips with non-planar transistor structures below 16 nanometers or NAND flash memory chips with more than 128 layers.

        In fact, before this, the U.S. ZF has repeatedly introduced bans and bills related to the chip sector, including the Chip and Science Act and restrictions on the export of high-performance GPUs from relevant companies to China. However, the scope of this export control restrictions are more extensive, and the impact may also be greater.
        Publicly available information shows that the relevant rules are as follows.
1. adding certain advanced and high-performance computing chips and computer commodities containing such chips to the Commerce Control List (CCL)
2. adding new licensing requirements for Chinese supercomputer or semiconductor development or production end-use projects
3. extending the Export Administration Regulations (EAR) to certain foreign-produced advanced computer products and foreign-produced supercomputer end-use product 
4. expanding the scope of production projects in countries other than the United States that require a license to 28 existing entities located in China. 
5. adding certain semiconductor manufacturing equipment and related items to the CCL.
6. Add new licensing requirements for equipment manufactured in China in compliant semiconductor manufacturing facilities. Licenses for facilities owned by Chinese companies will face "presumptive denial" and company-owned facilities will be determined on a case-by-case basis, specifically in the areas of: logic chips with non-planar transistor structures (FinFETs or GAAFETs) with 16nm or less than 14nm processes; half-pitch up to 18nm DRAM memory chips; NAND flash memory chips with 128 or more layers. 
7. restricting U.S. entities from supporting the manufacture, development, or production of certain semiconductor fabs in China without a license.
8. adding new licensing requirements for export programs that develop or produce semiconductor manufacturing equipment and related items. 
  1.  establishing a Temporary General License (TGL) to minimize short-term impacts on the semiconductor supply chain by allowing specific, limited production activities. 
        It is noted that the above restrictions on semiconductor manufacturing projects are effective October 7, the restrictions on the ability of U.S. persons to support the development, production, or application of integrated circuits based on China's domestic semiconductor manufacturing "facilities" will be effective October 12, and the advanced computing and supercomputer controls and other updates in the rule will be effective October 21. The updated export controls will take effect in several ways. 
        The updated export controls will target Chinese companies in a number of ways, including restrictions on U.S. companies exporting critical chip manufacturing tools to China and restrictions on U.S. cit izens and companies providing any form of direct or indirect support to Chinese semiconductor manufacturing facilities.


 
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