In the face of Intel's preemption of the 3nm generation, sources say AMD's Su Zi Feng will visit TSMC in July to discuss the future
Views : 135
Update time : 2023-06-30 08:53:15
According to "Electronic Times", AMD CEO Su Zi Feng will go to Taiwan in mid-July to meet with Siang Shuo and Sun Moon Group, and visit TSMC President Wei Zhejia and other senior executives to explain its latest product blueprint and outlook to the PC and server supply chain and customers, and listen to the views of important partners on the industry market situation, and will also discuss 4/3nm process and advanced packaging cooperation with TSMC.
According to semiconductor industry sources, the main reason for the trip is that Intel has revised its cooperation with TSMC at 3nm (mainly Arrow Lake and new GPUs), which will be a major crisis for AMD, whose PC platform is still stuck at 4nm in the next 2 years.
Intel has been in the red for two consecutive quarters due to the plunge in PC demand and the difficulty in reducing supply chain inventories, while AMD also performed poorly in the same period, with first quarter revenue down 9.1% to $5.353 billion.
Simply put, AMD's NB and DT products will remain above 4nm until 2025, with the Hawk Point, which is set to succeed the Phoenix Point in 2024, still featuring the Zen 4 architecture and 4nm process, and the Krackan Point, which is set to take over in 2025, upgrading the Zen 5 architecture but still using the 4nm process.
On the contrary, although Intel has postponed cooperation with TSMC due to the Meteor Lake series, the Arrow Lake series in 2024 has been confirmed to use the 3nm process, and TSMC will not only OEM the GPU part, but also the CPU tile has been wrapped. In this way, Intel has TSMC to help, and AMD, which has not yet received 3nm orders, will lag behind.
It seems that AMD will adopt 5/6nm process for Raphael series, 4/6nm process for Granite Ridge series to be launched at the end of 2024, 7nm and 4nm for mainstream Cezanne and Phoenix Point in 2023, and 4/6nm for high-end processor Shimada Peak in 2025. The 2025 high-end processor Shimada Peak is based on 4/6nm.
On the whole, AMD's DT and NB platform processors will stay at 4nm until the end of 2025, and the first EPYC series to enter the 3nm generation will only be launched in the second half of 2024 at the earliest, while the Zen 6 architecture processor with 2nm process is expected to debut in 2026 at the earliest. Until then, AMD is afraid that it is difficult to hard with Intel in terms of process.
The LDK220 series of low-dropout linear regulators (LDOs) is a high-performance device designed specifically for low-power consumption and high-precision voltage regulation, widely used in scenarios such as consumer electronics, industrial control, and po
Xilinx Spartan®-7 FPGA Family stands as a defining solution in the mid-range FPGA landscape, blending high performance, energy efficiency, and cost-effectiveness to redefine versatility for industrial, IoT, and consumer electronics applications. Built on
The Altera FLEX series was more than a lineup of FPGAs—it was a blueprint for how programmable logic devices could evolve to meet diverse market needs. The FLEX 8000 laid the architectural groundwork, the FLEX 10K redefined functionality with embedded mem
Among TI standout offerings, the LM4765 and LM4766 are dual-channel amplifiers designed to cater to diverse audio needs—from compact setups to high-fidelity systems. While sharing the same product lineage, these chips differ significantly in power output,
