| Feature | LM339 | LM339N |
| Package Type | Available in multiple packages: DIP-14 (plastic/ceramic), SOIC-14 (surface-mount), TSSOP-14, etc. | Exclusively a plastic through-hole DIP-14 package. |
| Assembly Method | Flexible: through-hole (DIP) or surface-mount (SOIC, TSSOP). | Strictly through-hole (requires soldering to DIP sockets or PCB holes). |
| Footprint Size | Varies by package; surface-mount versions (e.g., SOIC-14) have smaller footprints (~6mm × 10mm). | Larger footprint (DIP-14: ~19mm × 6.5mm) due to through-hole pins. |
| Heat Dissipation | Surface-mount packages (e.g., SOIC) offer better thermal conductivity to PCBs. | DIP-14 relies on pin conduction for heat dissipation; less efficient than surface-mount in high-power scenarios. |
| Cost | Slightly higher for specialized packages (e.g., ceramic DIP). | Generally lower due to standardized plastic DIP-14 production. |