Nippon Denso, invests $3.3 billion to expand semiconductor business
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Update time : 2023-11-01 16:44:57
DENSO CORPORATION (Denso) held a press conference at the JAPAN MOBILE 2023 show on October 26th at the Tokyo International Showground.
Shinnnouke Hayashi, President and COO of DENSO CORPORATION, said he is pleased that the Tokyo Motor Show, which has been in the public eye for decades, has changed its name to the JAPAN MOBILITY SHOW.This change reflects the fact that we are entering an era of creating new value from the viewpoint of a mobility-centered society that is not just about vehicles) and solving problems from the perspective of a mobility-centered society (not just vehicles), and by connecting people and technologies across industries. This means that we must address major challenges. In order to evolve from a "Tier 1 supplier supporting the automotive industry" to a "Tier 1 supplier supporting a mobility-centered society," and to create value for a more diverse range of customers, we have proposed three initiatives. To promote these three initiatives, we will recruit new employees in the electrification and software fields, actively transfer employees from mature fields to the electrification and software fields, and expand our workforce by approximately 4,000 employees over the four-year period from 2022 to 2025. In particular, in semiconductors, Denso will aggressively invest approximately 500 billion yen (approximately $3.3 billion) by 2030. By 2035, we are expanding our business to three times its current size. To expand production, we must secure stable procurement of materials. Therefore, we will establish strategic partnerships with a number of companies. In April, Denso developed the first inverter using silicon carbide (SiC) semiconductors. The inverter is integrated into the eAxle, an electric drive module developed by BluE Nexus, and will be used in the new RZ, Lexus' first recently released pure electric vehicle (BEV) model. Driving tests using pure electric vehicles equipped with SiC inverters have shown the efficiency gains that can be expected in practice: in the tests, power losses were reduced by more than half compared to vehicles equipped with conventional silicon technology inverters. This efficiency gain is directly reflected in the corresponding increase in the vehicle's driving range. Denso's inverters are equipped with SiC power semiconductors featuring the company's proprietary trench-type metal-oxide-semiconductor (MOS) structure, which increases the output of each chip due to the reduction of power losses caused by heat generation. With this unique structure, the transistors achieve high voltage and low on-resistance operation - however, Denso did not elaborate on these figures. The inverter was manufactured using SiC epitaxial wafers developed by Denso in collaboration with Toyota's Central R&D Laboratory. The development incorporates the results of work commissioned by Japan's national R&D agency, the New Energy and Industrial Technology Development Organization (NEDO). As a result of these R&D activities, Denso semiconductor experts were able to halve the number of crystal defects that prevent devices from functioning properly due to disordered arrangement of crystal atoms. By reducing crystal defects, the quality and stable production of SiC power semiconductor devices for automotive applications have been assured. Denso has named its SiC technology "REVOSIC". The company said it plans to utilize the technology to fully develop products from wafers to semiconductor devices and modules such as power cards. Power transistors utilizing this technology are already being used in Toyota's Mirai, a hydrogen fuel-cell vehicle that will go on sale in December 2020, the company said.
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