Patent data shows TSMC leads the battle for advanced chip packaging
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Update time : 2023-08-07 11:44:34
On August 2, according to LexisNexis patent data, TSMC leads other competitors in advanced chip packaging technology, followed by Samsung Electronics of South Korea and Intel of the United States. Advanced chip packaging technology is a key technology that can improve chip performance and is crucial for manufacturers competing for the chip foundry business.
According to LexisNexis, a data and analytics company, TSMC holds 2,946 patents for advanced chip packaging and is of the highest quality, a metric that includes the number of patents cited by other companies. Samsung Electronics ranked second in terms of number and quality of patents, with 2,404 patents. Intel ranked third with 1,434 patents. As it becomes increasingly difficult to integrate more transistors into a single piece of silicon, advanced chip packaging technology is critical to improving semiconductor design. Technology allows the industry to stack or splice together multiple chips, known as "chiplets," in the same container. Samsung Electronics has been investing in advanced chip packaging technology for years, but the company formed a dedicated team in December 2022 to develop the technology, Moonsoo Kang, head of the team, said in a statement. Intel has rejected the idea that TSMC's patent portfolio size suggests it has more advanced technology. Benjamin Ostapuk, vice president of the company's intellectual property law group, said in a statement that the company's patents protect its intellectual property and that its patent investments are carefully selected.
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