Samsung expects volume production of 1.4nm process in 2027
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Update time : 2022-10-11 11:03:05
At the recent Samsung Foundry Forum, Si-young Choi, President of Samsung Electronics Foundry Business, revealed in his keynote speech that Samsung will achieve mass production of 2nm process in 2025 and 1.4nm in 2027.
On June 30 this year, Samsung was the first to launch production of 3nm process chips based on GAA (fully encircled gate) architecture. si-young Choi said that Samsung will continue to enhance GAA-related technologies and move them into process processes at the 2nm and 1.7nm nodes. 2025 may be the point in time when Samsung and TSMC will go head-to-head with the 2nm process. Information shows that TSMC will introduce the GAA architecture at the 2nm node and is expected to enter risky pilot production in the second half of 2024 and mass production in 2025. In terms of transistor technology for the GAA architecture, Samsung has adopted MBCFET (Multi Bridge Channel Transistor) technology in its 3nm process, achieving a 23% performance improvement, 45% lower power consumption and 16% less chip area compared to its 5nm process. TSMC has introduced nanosheet technology, whose N2 process achieves a 10%-15% speed increase at the same power consumption and a 23%-30% power reduction at the same speed compared to TSMC's enhanced 3nm process. At 2nm and below, high performance computing will be an important application area and growth driver. According to Counterpoint, global cloud service providers' capital expenditures will grow 23% year-over-year in 2022, maintaining a double-digit compound annual growth rate over the next three years, a source of confidence for TSMC and its HPC customers to remain optimistic about advanced processes. The market demand for AI-accelerated chips is expected to maintain a compound annual growth rate of over 30% in the coming years. This explains why TSMC's 2nm process has introduced integrated solutions for HPC and Chiplet, in addition to its standard process for mobile processors. Samsung has also stated that the more advanced process technologies are aimed at high-performance computing, artificial intelligence, 5G/6G connectivity and autonomous driving. However, mobile processors, which have continuously been the largest source of profit for head OEMs until the first quarter of 2022, have not stopped the process dive. A supply chain source recently said that Apple expects to gradually replace its own processors using the 3nm Finfet process within three years, and be the first to use TSMC's 2nm GAA technology to develop chips in 2025. While upgrading foundry technology, the head foundry is also actively investing in advanced packaging technology to provide systemic solutions. si-young Choi said Samsung will accelerate its 2.5D/3D heterogeneous integrated packaging technology to provide systemic foundry service solutions. Samsung's X-Cube 3D packaging technology with micro-bump connections will be ready for mass production in 2024, and the bump-free X-Cube packaging technology will be available in 2026.
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