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Samsung plans to add at least 10 EUV lithography equipment next year

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Update time : 2023-01-14 11:23:42
        On December 27, Samsung, a leading memory chip company, planned to expand the capacity of P3 factory, its largest chip manufacturer in Pyeongse, South Korea, next year. According to the reporter, according to the contract, the factory will also increase the capacity of 4nm chips and purchase at least 10 EUV lithography machines.
        As we all know, the DRAM market is in a downward phase. TrendForce, a market research institution, said that DRAM prices have been falling all the way since the beginning of the year, and the contract price in the second half of the year fell more than 10% every quarter. In view of the sharply shrinking market demand, most manufacturers choose to reduce production capacity. On December 21, American memory chip giant Micron announced that it would cut 10% of its workforce to cope with the weakening demand for consumer electronic products and chips. SK Hynix also said that in response to the market environment, its capital expenditure will remain flexible.

        As a leading enterprise in this field, Samsung still occupied the first place in the global DRAM market in the third quarter of this year, but its market share declined. According to the data of Omdia, a market research company, the global DRAM sales in the third quarter of this year were US $17.548 billion, down 29.8% from US $24.984 billion in the previous quarter. Samsung's DRAM market share in the third quarter was 40.6%, down 2.8% from 43.4% in the previous quarter.
        However, Samsung not only does not intend to weaken memory output, but also plans to go against the trend. It plans to increase the DRAM equipment of P3 factory next year and expand the 12 inch wafer capacity required by its DRAM memory chips. It is estimated that 70000 12 inch wafers can be produced every month. As of the third quarter of this year, Samsung Electronics' overall DRAM crystal monthly output was 665000 pieces.
        In addition, according to the OEM contract, Samsung P3 Factory will also increase the capacity of 4nm chips. In order to meet customer demand, the factory will purchase at least 10 new EUV lithographers next year on the basis of the existing 40 EUV lithographers to expand the capacity.
        In terms of technology research and development, Samsung successfully developed 16Gb DDR5 DRAM using a 12 nanometer process, and recently completed a compatibility test with AMD. It is reported that this product is the most advanced high-performance and low-power DDR5 DRAM in the industry. Samsung said that in order to seize the gradually expanding DDR5 market, it plans to start mass production of 16Gb DDR5 DRAM from next year and supply to customers in data center, artificial intelligence and other fields.
        Jooyoung Lee, senior vice president and DRAM product and technology director of Samsung Electronics, said, "Samsung's 12 nanometer DRAM will become the key factor to promote the widespread adoption of DDR5 DRAM in the whole market. With excellent performance and energy efficiency, we hope that the new DRAM can become the basis for more sustainable operations in the next generation of computing, data center, AI drive system and other fields."

 
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