Samsung Pushed FO-PLP 2.5D Advanced Packaging Technology to Catch up with TSMC
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Update time : 2023-09-18 08:55:53
South Korean media pointed out that in order to catch up with TSMC's advanced packaging artificial intelligence (AI) chips, Samsung will launch FO-PLP's 2.5D advanced packaging technology to attract customers.
South Korean media Etnews reported that the advanced packaging (AVP) team of Samsung DS division began to develop FO-PLP advanced packaging for 2.5D chip packaging, which can integrate SoC and HBM into silicon interposers to build a complete chip.
2.5D packaging is an indispensable process for artificial intelligence chips in recent years. In the case of NVIDIA artificial intelligence chips, which are in short supply worldwide, it is integrated with 2.5D packaging technology, but TSMC CoWoS 2.5D advanced packaging won the order.
Unlike TSMC CoWoS 2.5D, Samsung FO-PLP 2.5D is packaged on a square substrate, TSMC CoWoS 2.5D is a circular substrate, Samsung FO-PLP 2.5D will not have edge substrate loss problems, has higher productivity, but because the chip is transplanted from the wafer to the square substrate, the operating procedure is more complicated.
Samsung's strategy is to use FO-PLP 2.5D to catch up with TSMC, as the Samsung DS division began to research the commercialization of smart watch and smartphone processors and expand the use of FO-PLP after acquiring FO-PLP from Samsung Electric in 2019. It is currently used in power semiconductor packaging.
The report quoted South Korean market sources as saying that from the international academic conference Samsung successively published FO-PLP papers, Samsung is committed to developing FO-PLP to overcome the limitations of 2.5D packaging. If FO-PLP is successful, it can be leveraged with foundry and memory business, so Samsung proposed a turn-key solution to attract customers to produce semiconductors, HBM and advanced packaging for AI designers such as NVIDIA and AMD. If advanced packaging is more competitive, Samsung can grow its semiconductor business.
South Korean market participants pointed out that TSMC does exert a huge influence due to 2.5D advanced packaging, so Samsung has also increased investment in advanced packaging to catch up with TSMC.
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