Samsung's Advanced Packaging Technology Lags TSMC: It 's Hard to Get Orders for AI Chips
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Update time : 2023-07-05 14:01:18
July 3 news, Nvidia A100 and H100 are currently completely outsourced to TSMC foundry, Samsung failed to win any orders, this is entirely because TSMC CoWoS advanced packaging technology is leading.
By 2023, AI chips will rise, and Nvidia's GPU demand for CoWoS will soar from an estimated 30,000 at the beginning of the year to 45,000, and orders will have to be added in advance. Now Nvidia, Apple and AMD all rely on TSMC's advanced process and packaging technology. According to a report by market research firm Yole Development, Intel and TSMC will account for 32% and 27% of global advanced packaging investment in 2022, with Samsung ranking only fourth, even behind Taiwan's packaging and testing giant. Therefore, even if Samsung leads TSMC in successfully mass-producing 3nm process wafers in 2022, global leaders such as Nvidia and Apple still hope to use TSMC's production capacity, which also makes the current large foundry orders for all AI and autonomous driving chips. Almost all are in TSMC's hands . It is worth noting that Samsung also said at the Hot Chips conference in June 2021 that it is developing advanced 3.5D packaging technology, but Samsung did not disclose specific details. The establishment of Samsung's advanced packaging working group obviously means that Samsung will further increase its investment in advanced packaging technology, aiming to narrow the gap with Intel and TSMC in the field of advanced packaging.
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