Sources revealed that TSMC urgently ordered packaging equipment to meet Nvidia's AI chip needs
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Update time : 2023-06-09 11:40:04
On June 7, according to foreign media reports, the increase in demand for artificial intelligence applications such as ChatGPT has boosted demand for high-performance GPUs such as Nvidia H100 and A100, which has also prompted them to increase orders at TSMC foundry to meet customer needs.
Nvidia's increase in TSMC orders also boosted capacity utilization of TSMC's advanced process technology. Previously, sources revealed that Nvidia's new orders have pushed up the capacity utilization rate of TSMC's two major process technology families, 7/6nm and 5/4nm, which are nearing saturation. The latest reports from relevant media show that Nvidia's orders have not only pushed up the capacity utilization rate of TSMC fabs, but also increased the capacity demand for their chip packaging. TSMC has also urgently ordered packaging equipment. Relevant media quoted sources from fab tool manufacturers as saying that TSMC has urgently ordered packaging equipment. According to the sources, TSMC ordered CoWoS packaging (Chip onWafer on Substrate, wafer-level packaging) equipment, and they urgently ordered it to meet the surge in demand for Nvidia artificial intelligence chips. It is worth noting that at the end of last month, industry insiders revealed that demand for Nvidia artificial intelligence chips is improving, and it is also good for back-end manufacturers. Relevant manufacturers are re-optimistic about the business prospects in 2023. While the capacity utilization rate of advanced process technology has increased, it is also urgently ordering packaging equipment, which means TSMC will become a major beneficiary of the increased demand for Nvidia artificial intelligence chips. Against this background, the chip market is still not optimistic and can significantly improve their revenue.
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