Transphorm Introduces TOLL Packaged FETs Positioning GaN as the Best Device to Support High Power Energy Consumption AI Applications
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Update time : 2023-12-04 09:54:18
Three new devices bring the benefits of SuperGaN's Normally-Off D-Mode platform to SMD's high power systems that require higher reliability and performance at high power densities and generate lower heat.
Transphorm, Inc. recently announced the availability of three SuperGaN® FETs in TOLL packages with on-resistance of 35, 50, and 72 mOhm. Transphorm's TOLL package configurations utilize industry standards, which means that SuperGaN power tubes in TOLL packages can be used as a direct replacement for any SuperGaN power tubes utilizing e-mode TOLL solutions. The new devices also feature Transphorm's The new devices also feature Transphorm's proven high-voltage dynamic (switching) on-resistance reliability-something that is lacking in the mainstream foundry e-mode GaN on the market. These three surface-mount devices (SMDs) support higher power applications with an average operating power range of 1 to 3 kilowatts. Such power systems are commonly used in high-performance areas such as computing (artificial intelligence, servers, telecom, data centers), energy and industrial (photovoltaic inverters, servo motors), and a wide range of other industrial markets. Currently, the global potential market size (TAM) for gallium nitride in this market segment is $2.5 billion. Of interest, this new power device is currently the best solution for rapidly evolving Artificial Intelligence (AI) systems, which rely on GPUs, which consume 10 to 15 times more power than traditional CPUs. Currently, a variety of mainstream customers in the high-performance sector are beginning to use Transphorm's high-power GaN devices to provide power support for their high-performance systems in applications such as data center power supplies, high-power gaming PSUs, UPSs, and microinverters. The new TOLL package devices are also capable of being used in DC-DC converter and on-board charger applications for electric vehicles, as the core SuperGaN chip has been certified to automotive industry (AEC-Q101) standards. The SuperGaN FET in TOLL form is the sixth package type introduced by Transphorm, giving customers the widest range of package options to meet their diverse design needs. As with all Transphorm products, this TOLL package device leverages the performance and reliability benefits inherent in Transphorm's normally closed d-mode SuperGaN platform.
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