TSMC announces the establishment of 3DFabric Alliance, and several chip giants intend to join
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Update time : 2022-10-28 13:46:12
On October 27, TSMC announced the establishment of the Open Innovation Platform (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum.
The new 3DFabri alliance is the first OIP alliance among semiconductor industry partners to work together to accelerate the innovation and preparation of 3D IC ecosystem. It will provide all-round first-class solutions and services for semiconductor design, storage module, substrate technology, testing, manufacturing and packaging. "3D silicon stacking and advanced packaging technology have opened the door to a new era of chip level and system level innovation, which requires extensive ecosystem cooperation to help technical designers find the best path," said Dr. L.C. Lu, researcher and vice president of design and technology platform of TSMC. It is reported that the partners of the new 3DFabric alliance can use TSMC's 3DFabric technology in advance, enabling them to develop and optimize their own solutions in parallel with TSMC. This provides customers with a leading starting point in product development. From EDA and IP to DCA/VCA, memory, OSAT (outsourced semiconductor assembly and testing), substrate and testing, they can get the highest quality, off the shelf solutions and services as soon as possible. 3DFabric is a comprehensive family of 3D silicon stacking and advanced packaging technologies, which further expands the company's advanced semiconductor technology products to unleash system level innovation. TSMC 3DFabric includes front-end 3D chip stack or TSMC soic ™ And back-end technologies, including CoWoS ® And InFO series packaging technology. In addition to the CoWoS and InFO already in mass production, TSMC - soic silicon stack production will also begin in 2022. At present, TSMC has the world's first 3DFabric fully automated chemical plant in Taiwan, China, China. It integrates advanced testing, TSMC soic and InFO operations together to provide customers with the best flexible solutions through better cycle and quality control. As the most comprehensive and dynamic ecosystem in the industry, TSMC OIP consists of six alliances: EDA Alliance, IP Alliance, Design Center Alliance (DCA), Value Chain Alliance (VCA), Cloud Alliance, and now 3DFabric Alliance. TSMC began to plan OIP in 2008 to reduce design barriers and promote the rapid implementation of innovation in the semiconductor design community by bringing together the c reative thinking of customers and partners. At present, many TSMC partners, including Advantest, Alpha, Alphawave, Amkor, Ansys, ARM, ASE, Cadence, GUC, IBIDEN, Micron, Samsung Memory, Siemens, Silicon Creations, SK hynix Synopsys, Teradyne, Unicron and others, have expressed their willingness to join the 3DFabric alliance.
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