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TSMC Launches a New Round of Orders to Advanced Packaging Equipment Suppliers

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Update time : 2023-08-07 11:06:20
        According to reports, TSMC has recently launched a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, GUUDENG Precision Industrial, and Scientech.
 
 
        With the official mass production of AMD MI300 series in the fourth quarter, and Nvidia continuing to require TSMC to solve the shortage problem caused by insufficient CoWoS packaging capacity as soon as possible, TSMC was forced to accelerate the expansion of its advanced packaging capacity. In addition, TSMC has continued to receive CoWoS packaging orders from other major customers such as Amazon, Broadcom and Xilinx.
        It is reported that the rapid demand of Nvidia AI GPU a few months ago led to a serious shortage of advanced packaging capacity of TSMC CoWoS. Recently, Wei Zhejia, president of TSMC, said frankly that he had previously held a conference call with customers to ask for expansion of CoWoS capacity. The equipment manufacturer estimates that TSMC's total CoWoS production capacity will exceed 120000 pieces in 2023, and will increase to 240000 pieces in 2024, of which Nvidia will obtain 144000~150000 pieces.
        In June, TSMC Chairman Liu Deyin stated that TSMC's own advanced packaging capacity has almost doubled since last year, and if it wants to double again from this year to next year, it is indeed a challenge. In response to the expansion of CoWoS production capacity for advanced packaging next year, some INFO production capacity has even been moved to Nanke.
        In July, TSMC announced that the new CoWoS advanced packaging plant will be built in Taiwan, China's Zhuke Causeway Park, with an estimated investment of NT $90 billion. The new plant is expected to be completed by the end of 2026, and mass production will begin in the third quarter of 2027.
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