TSMC trial production of 2nm chips for Apple and NVIDIA
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Update time : 2023-06-20 11:11:26
According to foreign media reports, TSMC, the world's leading foundry, has not only started to develop 2nm processes, widening the gap with its competitors, but TSMC has also recently started preparing to start trial production of 2nm products for Apple and NVIDIA. In addition, TSMC will send around 1,000 R&D staff to work at its Fab 20 fab, currently under construction in Jhuke, to develop 2nm technology.
The foreign media Patently apple reported that Samsung Electronics started mass production of 3nm chips using GAA technology in June 2022, six months ahead of TSMC, becoming the first company in the world to mass produce the process technology. The impact of Samsung's pre-emptive strike has led TSMC executives to repeatedly make public their plans for the development of 2nm process technology, forming a race for advanced process development.
In addition to TSMC, processor major Intel, which previously announced plans to re-enter the foundry business in 2021, has also joined the race for advanced process development. The US semiconductor major began to expand its presence in the foundry industry by unveiling the technical developments, test data and roadmap for its back-of-chip power solution PowerVia at an online event on 1 June local time. Current TSMC is also reportedly developing technology for powering the back of chips, with the goal of using the technology by 2026.
In addition, Intel has set a goal of advancing its foundry technology to the 1.8nm node by the second half of 2024. in March, the company laid out a plan to reach volume production of 1.8nm process technology through a partnership with ARM. However, there is some uncertainty among market participants that even if Intel succeeds in following its roadmap, it will still be a big challenge for the company to eventually break even.
The report also illustrates the case of TSMC's other rival, Samsung, in that Kyung Kye-hyun, president of Samsung's DS division, said in a speech in early May that Samsung plans to overtake TSMC, aiming to start with a 2nm process that uses GAA technology earlier than TSMC.
In fact, TSMC is maintaining its technological lead through advanced packaging technology in addition to advanced processes. Not long ago, TSMC announced the opening of its Advanced Packaging Fab 6, making it the first TSMC fab to achieve 3DFabric integration of front and back-end processes in an automated advanced packaging and test service facility. It also prepares for the mass production of TSMC-SoIC (System-on-Chip) process technology. The opening of the Advanced Packaging and Test Fab 6 will provide TSMC with more complete and flexible capacity planning for TSMC 3DFabric advanced packaging and silicon stacking technologies such as SoIC, InFO, CoWoS and advanced test, as well as higher production yields and performance synergies.
He Jun, Vice President of Operations/Advanced Packaging Technology and Service, Quality and Reliability of TSMC, said, "Microchip stacking is a key technology to improve chip performance and cost efficiency. TSMC has completed advanced deployment of advanced packaging and silicon stacking technology capacity to provide technology leadership and capacity to meet customer needs through the 3DFabric platform.
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