Using TSMC's 3nm Process, Marvell Launched the World's First 3nm Chip
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Update time : 2023-05-04 11:28:08
Recently, U.S. chip company Marvell, has finally officially released the world's first 3nm chip, a data center chip built on TSMC's 3nm process.
According to Marvell, its TSMC 3nm-based chip can be used to design a comprehensive silicon IP portfolio of chips that will fundamentally improve the bandwidth, performance and power efficiency of next-generation data infrastructures. The division is pioneering the 112G XSR SerDes (serializer/deserializer), Long Reach SerDes, PCIe Gen 6 PHY / CXL 3.0 SerDes and 240 Tbps parallel chip-to-chip interconnect in the 3nm node for managing data flows in the data infrastructure.
According to Marvell, SerDes and parallel interconnects act as high-speed channels in the chip to exchange data between chips or silicon components within the Chiplet, and together with 2.5D and 3D packaging, these technologies will eliminate system-level bottlenecks to advance complex semiconductor designs. .
The new parallel chip-to-chip interconnect enables aggregated data transfers of up to 240Tbps, 45% faster than available alternatives for multi-chip package applications. In other words, this new solution interconnects the equivalent of downloading 10,000 HD movies per second, albeit at distances of a few millimeters or less.
Marvell has integrated its SerDes and interconnect technologies into its flagship silicon solutions, including Teralynx switches, PAM4 and coherent DSPs, Alaska Ethernet physical layer (PHY) devices, OCTEON processors, Bravera storage controllers, Brightlane automotive Ethernet chipsets and custom ASICs. while the move to 3nm process enables engineers to reduce the cost and power consumption of chips and computing systems while maintaining signal integrity and performance.
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