Winbond Helps STMicroelectronics Enhance STM32 Series Memory Performance for Smart Industrial and Consumer Applications
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Update time : 2023-03-13 14:37:48
WinbondElectronics, a global leader in semiconductor storage solutions, and STMicroelectronics, a leading global semiconductor company serving multiple electronics applications, today announced a partnership to bring Winbond's niche memory chips and memory modules into STMicroelectronics' STM32 family of microcontrollers (MCUs) and microprocessors (MPUs).
With this partnership, the two companies will aim to optimize integration and improve performance, as well as ensure the long-term availability of Winbond and ST's devices to further meet the needs of customers in the industrial market. "Windbond’s memory products combine the advantages of small size, low power consumption and low pin number packaging to simplify device interconnection and save PCB cost, making them the perfect choice for embedded devices," said Mr. He Mingzhe, product marketing and technology manager of Huabang DRAM. We believe this partnership will make it easier for product developers to integrate our high performance memory with STM32 devices." The STM32 family offers industry-leading 32-bit MCU and MPU products based on the Arm® Cortex core, combining high performance, high power efficiency, ultra-low power consumption, advanced peripherals and a perfect interface to the extensive STM32 ecosystem, including software, tools, evaluation boards and kits that simplify and accelerate the development process. Kamel Kholti, Product Marketing Manager of STM32MPU ecosystem at STMicroelectronics, said: "We are very pleased to establish a close partnership with Winbond Electronics on the STM32MPU family. In fact, as a global leader in general-purpose MCUs, ST is expanding the STM32 family into the MPU space and for that we need strong DRAM suppliers to collaborate and support our customers." The current focus of this collaboration aims to combine Winbond's DDR3 memory with ST's STM32MP1 family of microprocessors. STM32MP1 MPUs can be equipped with up to two Cortex-A7 cores and integrate a variety of features such as advanced peripherals, IoT security hardware and on-chip high-efficiency power conversion circuits. Winbond DDR3 memory can be used as a memory buffer for the MPU, bringing performance upgrades to industrial gat eways, data concentrators, smart meters, barcode scanners, smart homes, and many other applications that require high performance and advanced security. In addition, Winbond will also introduce HYPERRAM products as memory buffers, providing ideal support for STMicroelectronics' latest ultra-low power MCU STM32U5 based on the advanced Cortex-M33 core. HYPERRAM interfaces are compatible with older interface standards such as SDR and early DDR, and can be directly replaced, helping to reduce system energy consumption across the board. With significantly higher performance than traditional pSRAM, HYPERRAM provides the high-speed, low-cost, low-pin-count and ultra-low-power memory solution required by the STM32U5.
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