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ASML Launches High NA Lithography for 2nm Chip Fabrication in 2024

ASML Launches High NA Lithography for 2nm Chip Fabrication in 2024

Dec 26, 2023

12-262023

After the gradual mass production of 3-nanometer chips, 2-nanometer chips have become the point of contention for the next generation of advanced chip processes. The sole supplier of this chip process equipment, ASML, has also been pushed to the forefront
Sai microelectronics and subsidiaries to 180 million yuan to set up a joint venture to implement MEMS high-frequency communication device manufacturin

Sai microelectronics and subsidiaries to 180 million yuan to set up a joint venture to implement MEMS high-frequency communication device manufacturin

Dec 22, 2023

12-222023

Sai Microelectronics announced that the company intends to sign the "Investment Agreement" with Huaisheng High-Tech, Huairou Science and Technology Service, and Sai Micro Private Placement, a subsidiary of the company, to jointly invest in the establishme
Intel: dozens of PC makers to use new Meteor Lake AI chip

Intel: dozens of PC makers to use new Meteor Lake AI chip

Dec 22, 2023

12-222023

Intel says dozens of personal computer (PC) makers are using its latest artificial intelligence (AI) chip as the company and its customers try to entice consumers to upgrade their devices for a new era of chatbots.
Nexperia Introduces GaN FETs in Compact SMD Package CCPAK for Industrial and Renewable Energy Applications

Nexperia Introduces GaN FETs in Compact SMD Package CCPAK for Industrial and Renewable Energy Applications

Dec 21, 2023

12-212023

Nexperia, the high volume manufacturing specialist in basic semiconductor devices, today announced the launch of a new GaN FET device that utilizes next-generation, high-voltage GaN HEMT technology and a proprietary copper-clip CCPAK surface mount package
Transphorm Partners with Allegro MicroSystems to Improve GaN Power System Performance in High Power Applications

Transphorm Partners with Allegro MicroSystems to Improve GaN Power System Performance in High Power Applications

Dec 21, 2023

12-212023

Transphorm, Inc. (Nasdaq: TGAN), a leading global supplier of gallium nitride (GaN) power semiconductors, announced that it has partnered with Allegro MicroSystems, Inc. (Allegro) (Nasdaq: ALGM), a global leader in power and sensing semiconductor technolo
Nikon Announces ArF Immersion Lithography NSR-S636E with 15% Increase in Productivity

Nikon Announces ArF Immersion Lithography NSR-S636E with 15% Increase in Productivity

Dec 21, 2023

12-212023

Nikon has announced that it will release the ArF Immersion Scanner NSR-S636E from January 2024 as an exposure system for critical layers with higher productivity and a high level of overprint accuracy and throughput, according to an official Nikon news re
Samsung Announces New Product Release Schedule: Upgraded LPDDR5X Memory Chips, Pluggable Automotive SSDs Next Year

Samsung Announces New Product Release Schedule: Upgraded LPDDR5X Memory Chips, Pluggable Automotive SSDs Next Year

Dec 20, 2023

12-202023

Comprehensive financial news agency, South Korea's "Daily Economy" and other media reports, Samsung recently held an investor forum in China's Hong Kong SAR, and announced a series of automotive products schedule. Samsung plans to launch an upgraded versi
Transphorm Partners with Allegro MicroSystems to Improve GaN Power System Performance in High Power Applications

Transphorm Partners with Allegro MicroSystems to Improve GaN Power System Performance in High Power Applications

Dec 20, 2023

12-202023

Transphorm, Inc. (Nasdaq: TGAN), a leading global supplier of gallium nitride (GaN) power semiconductors, announced that it has partnered with Allegro MicroSystems, Inc. (Allegro) (Nasdaq: ALGM), a global leader in power and sensing semiconductor technolo
ST's next-generation NFC controller with built-in security unit supports STPay-Mobile digital wallet service

ST's next-generation NFC controller with built-in security unit supports STPay-Mobile digital wallet service

Dec 19, 2023

12-192023

STMicroelectronics has released the ST54L NFC controller and security unit in one chip. With this chip in place, mobile devices such as smartphones, smart wearables and tablets can access secure contactless ticketing and payment services via the STPay-Mob
Tibco Consulting: Taiwan Foundry Capacity Expected to Decline to 41% by 2027

Tibco Consulting: Taiwan Foundry Capacity Expected to Decline to 41% by 2027

Dec 19, 2023

12-192023

The results of the Tibco Consulting survey show that Taiwan accounts for approximately 46% of the global semiconductor foundry capacity as of 2023, followed by China (26%), South Korea (12%), the U.S. (6%), and Japan (2%). However, semiconductor capacity
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