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Kodiak Partners with Ambarella to Use Ambarella AI Domain Controller SoC in Self-Driving Trucks

Kodiak Partners with Ambarella to Use Ambarella AI Domain Controller SoC in Self-Driving Trucks

Jan 11, 2024

01-112024

Ambarella, the edge AI semiconductor company, and Kodiak Robotics, a self-driving vehicle company focused on trucking and defense, announced that Kodiak has selected Ambarella's CV3-AD685 AI Domain Control System integrated chip (SoC) as a complete embedd
Rohde & Schwarz and NXP Introduce First Reference Design for 28nm Short Range Automotive Radar

Rohde & Schwarz and NXP Introduce First Reference Design for 28nm Short Range Automotive Radar

Jan 11, 2024

01-112024

ST's next-generation multi-zone time-of-flight sensor improves ranging performance and energy efficiency

ST's next-generation multi-zone time-of-flight sensor improves ranging performance and energy efficiency

Jan 10, 2024

01-102024

ST's latest-generation 8x8 multi-zone time-of-flight (ToF) ranging sensor, the VL53L8CX, realizes a number of improvements, including greater immunity to ambient light interference, lower power consumption and enhanced optical performance.
STMicroelectronics Introduces Sensorless Zero-Speed/High-Torque Motor Control Embedded Software

STMicroelectronics Introduces Sensorless Zero-Speed/High-Torque Motor Control Embedded Software

Jan 10, 2024

01-102024

STMicroelectronics has released the STM32 ZeST* (Zero Speed Full Torque) software algorithm. The algorithm runs on STM32 microcontrollers and enables sensorless motor drives to produce maximum torque at zero speed. STMicroelectronics is currently sharing
Rumors say TSMC's third plant in Japan could be located in Yokohama or Osaka

Rumors say TSMC's third plant in Japan could be located in Yokohama or Osaka

Jan 09, 2024

01-092024

January 3, according to foreign media reports, rumors say TSMC's third factory in Japan may be located in Yokohama or Osaka.
South Korea's POSCO signs agreement with Zhongtai Cryogenic for joint venture to produce gases for semiconductors

South Korea's POSCO signs agreement with Zhongtai Cryogenic for joint venture to produce gases for semiconductors

Jan 09, 2024

01-092024

South Korea's POSCO announced on December 27 that it has signed an agreement with Chinese company Zhongtai Cryogenic to establish a joint venture to produce gases for the semiconductor industry in South Korea, with an annual capacity of 130,000 standard c
Samsung is developing a smart sensor system, and delayed its U.S. Tyler semiconductor plant mass production to 2025

Samsung is developing a smart sensor system, and delayed its U.S. Tyler semiconductor plant mass production to 2025

Jan 08, 2024

01-082024

According to foreign media reports, Samsung is developing a smart sensor system for controlling and managing semiconductor processes. This new technology is expected to improve semiconductor yields and productivity, and is expected to be applied to drones
Intel Revisits Moore's Law: The Cycle Is Slowing Down But Not Dead

Intel Revisits Moore's Law: The Cycle Is Slowing Down But Not Dead

Jan 08, 2024

01-082024

Moore's Law was first proposed by Intel co-founder and CEO Gordon Moore in 1970. Gordon Moore, co-founder and CEO of Intel, first proposed it in 1970, saying that the number of transistors on a chip would double every two years as the density of new proce
New 4.5 kV XHP™ 3 IGBT Module Allows Drives to Miniaturize Size and Maximize Efficiency

New 4.5 kV XHP™ 3 IGBT Module Allows Drives to Miniaturize Size and Maximize Efficiency

Jan 08, 2024

01-082024

There is a clear trend toward smaller IGBT modules for many applications and a shift of complex designs up the chain. In response to the global trend toward miniaturization and integration, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has introduced
Kongate Introduces New Intel® Core™ Ultra Processor Powered COM Express Compact Modules

Kongate Introduces New Intel® Core™ Ultra Processor Powered COM Express Compact Modules

Jan 06, 2024

01-062024

Kongate Germany has recently launched a new family of COM Express Compact Modules powered by Intel® Core™ Ultra processors. This new module is equipped with a unique heterogeneous computing engine including CPU, GPU and NPU to realize edge AI functions in
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