Intel is looking for "new materials and structures" to prepare 2000W class coolers for future chips
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Update time : 2023-04-21 12:04:31
If you want to cool PC hardware, it's an air-cooled or water-cooled cooler, but with more and more transistors on the chip, Intel is investing early on in designing the next generation of submerged liquid cooling solutions to better manage heat, save energy, reduce costs and reduce carbon emissions, and plans to introduce the industry's first open IP submerged liquid cooling solution and public version of the design. The company plans to launch the industry's first open IP submerged liquid cooling solution and public design, allowing for greater adoption of submerged liquid cooling without the need for costly custom design solutions.
According to TomsHardware, Intel is not just satisfied with submerged liquid cooling, as its developers are working on novel solutions to increase the cooling level of next-generation chips to 2000W. Intel is currently looking for "new materials and structures" and is working closely with other innovative cooling technology companies to provide better cooling technology and develop "science fiction-like" cooling solutions. One of Intel's new thermal solutions is based on a 3D homogenous heat sink that uses minimal space and an improved boiling enhancement coating to disperse boiling capacity within a sealed flat metal filled with liquid. Research has shown that coral-like heat sink designs with internal groove-like features have the greatest potential for external heat transfer coefficients for submerged liquid cooling. Intel envisions these ultra-low thermal resistance 3D homogeneous thermal panels integrated within a coral-like submerged liquid cooling heatsink manufactured using additive manufacturing technology. Another way Intel looks to cool the highest power devices is with an array of fluid jets, regulated by artificial intelligence, that can spray cold nights over the hot spots of the chip to remove heat. Intel's cooling technology isn't all about efficiency and energy savings; the new cooling technology allows chips to run at lower temperatures, resulting in a 5 to 7 percent increase in performance at the same power.
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