Meta (META.US) Signs Custom VR Chip Deal with Qualcomm (QCOM.US)
Views : 90
Update time : 2022-09-06 10:16:04
Meta Platforms announced Friday it has signed an agreement with Qualcomm to produce custom chipsets for Meta's Quest VRdevices. The two sides did not disclose financial details of the deal.
Meta and Qualcomm said in a statement that the companies' engineering and product teams will work together to produce chips powered by Qualcomm's "Snapdragon" platform. The partnership demonstrates Meta's reliance on Qualcomm technology, although Meta is trying to develop custom chips for its own range of VR, AR (augmented reality) and MR (mixed reality) devices. Meta CEO Zuckerberg said, "Unlike cell phones, building VR presents new multi-dimensional challenges in terms of spatial computing, cost and form factors." "We are still in the early stages of the metaverse, and this deep technology integration will help VR evolve into a multifunctional computing platform." Meta spokesman Tyler Yee said the chipset produced by the two companies in collaboration is not exclusive to Meta, but it will be specifically optimized for Quest's system specifications. tyler Yee said the partnership agreement only covers VR devices, while Meta will continue to work on developing its own chip solutions. For years, Meta's VR devices have reportedly relied on Qualcomm's chips, including its latest Quest 2 headset device. According to research firm IDC, the Quest 2 accounts for about 90 percent of the VR hardware market.
The LDK220 series of low-dropout linear regulators (LDOs) is a high-performance device designed specifically for low-power consumption and high-precision voltage regulation, widely used in scenarios such as consumer electronics, industrial control, and po
Xilinx Spartan®-7 FPGA Family stands as a defining solution in the mid-range FPGA landscape, blending high performance, energy efficiency, and cost-effectiveness to redefine versatility for industrial, IoT, and consumer electronics applications. Built on
The Altera FLEX series was more than a lineup of FPGAs—it was a blueprint for how programmable logic devices could evolve to meet diverse market needs. The FLEX 8000 laid the architectural groundwork, the FLEX 10K redefined functionality with embedded mem
Among TI standout offerings, the LM4765 and LM4766 are dual-channel amplifiers designed to cater to diverse audio needs—from compact setups to high-fidelity systems. While sharing the same product lineage, these chips differ significantly in power output,
