Renesas Electronics Took the Lead in Launching the I3C Intelligent Switch Product Family for the Next Generation of Server, Storage and Communication
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Update time : 2022-06-04 12:56:10
On May 31, 2022, the global semiconductor solution supplier Renesas Electronics (TSE:6723) announced that it was the first to launch the I3C intelligent switching device RG3MxxB12 series for the next generation server motherboard and other infrastructure equipment - the new chip greatly improved the scalability and reliability, while reducing the complexity of high-performance system design, Enable I3C control plane network with multiple initiating device controllers (such as CPU and BMC) to support targets in large physical networks at full speed by improving signal integrity and reducing capacitive load. The new product also supports heterogeneous design by providing IO level conversion and protocol conversion for hy brid I2C/SMBus and I3C networks. MIPI I3C bus, as an extensible control bus interface, is used to connect peripherals with processors or other management controllers. It has the advantages of high performance, stronger reliability, extremely low power consumption and low electromagnetic interference (EMI). These features also enable new system functions, such as advanced telemetry, fault recovery, side-band security, component authentication, and faster startup time. The current system design usually uses the traditional I2C protocol and a simple field effect transistor (FET) switch to connect the initiating device and the target device on the motherboard. This method cannot be extended to I3C speed, which fundamentally limits system management to the most basic functions. Renesas' new I3C intelligent switch product family allows two initiating device (uplink) ports to be expanded to four, eight or more target ports at the maximum speed, and has complete protocol awareness and compliance. The new Renesas product family also provides seamless conversion between I3C and I2C devices, allowing the plug and play compatibility of old devices on the control plane network. This I3C intelligent switch is the result of close cooperation between Renesas and Intel. It starts from concept conception, specification definition and other links before the roll out, and continues to the software development, component and system level verification after the roll out. Rami Sethi, vice president of Renesas electronic data center business unit, said: "As a pioneer of I3C hub and extender technology for DDR5 DIMM market, Renesas has always believed that this technology has great potential throughout the entire platform. We are honored to work with Intel to realize this vision through the new I3C intelligent switch product family. These devices will enable our users and partners to bring advanced platform management functions to each subsystem in the rack." Vik Tymchenko, vice president and general manager of platform hardware engineering of Intel, said: "We are very glad that Renesas and Intel have launched a strong cooperation to jointly define basic circuit solutions for the expanding use cases of MIPI I3C basic applications. New products such as the I3C intelligent switch product family help to eliminate the basic limitations faced by MIPI I3C interfaces in data center hardware. With the help of I3C switches, we can increase the capacitance and equipment supported by the I3C network." As a global leader in high-performance computing peripherals, Renesas' new I3C intelligent switch product family will be a powerful supplement to the solutions of Renesas' DDR5 I3C extender,RCD, PMIC, SPD center, temperature sensor and data buffer.
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