SK Hynix Develops Industry's First 12-Layer Stacked HBM3 DRAM Chip
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Update time : 2023-04-22 09:41:23
SK Hynix announced on its website that it has once again surpassed the technical boundaries of HBM3, the highest-performance DRAM (memory) available, by achieving the world's first vertical stacking of 12 individual DRAM chips and successfully developing a new HBM3 DRAM product with a maximum capacity of 24GB. The company said it is currently providing samples to customers and conducting performance evaluations.
SK Hynix said, "After being the first to mass produce the industry's first HBM3 in June last year, the company has successfully developed a 24GB package with 50% more memory capacity than its predecessor. We will supply the new product to the market in the second half of the year to meet the demand for high-end memory products driven by the AI chatbot industry." SK Hynix engineers have improved the process efficiency and performance stability of the new product by applying advanced batch reflow molded fill (MR-MUF) technology, while reducing the thickness of individual DRAM chips by 40 percent to the same stack height level as 16GB products through silicon through-hole (TSV) technology. HBM is a type of memory that was first developed by SK Hynix in 2013 and has received a lot of attention from the memory chip industry due to its crucial role in enabling generative AI running in high performance computing (HPC) systems. The latest HBM3 standard in particular is considered ideal for fast processing of large amounts of data, and as a result its adoption by major technology companies worldwide is increasing. SK Hynix has already provided samples of the 24GB HBM3 product to several customers who have expressed great expectations for the latest product, while performance evaluation of the product is also underway. "SK Hynix continues to develop a range of ultra-high-speed and high-capacity HBM products because of its leading-edge technology in the back-end process," said Sang-Ho Hong, head of SK Hynix's packaging and testing division. "The company plans to complete its mass production readiness for the new products in the first half of this year The company plans to complete volume production preparation for the new product in the first half of this year to further strengthen its leadership position in the cutting-edge DRAM market in the AI era."
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