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Hot demand for AI servers drives growth for PCB, HDI makers in Taiwan, China
Aug 03, 2023
08-03
2023
Hot demand for AI server products drove significant growth for PCB, HDI (high-density interconnect boards), and copper-clad substrate manufacturers in Taiwan, China. NVIDIA's enhancement of server specifications has led to a further increase in demand for
AMD to push AI chips to rival Nvidia by end of this year, bullish on China's AI market
Aug 03, 2023
08-03
2023
AMD Inc. forecasts that it expects to finish the year strong as it plans to launch artificial intelligence (AI) chips that can compete with NVIDIA Semiconductor.AMD CEO Lisa Su said AMD will increase production of its flagship MI300 AI chips in the fourth
HBM demand soars as Samsung, SK Hynix invest over 2 trillion won in aggressive production expansion
Aug 03, 2023
08-03
2023
The rapid development of ChatGPT generative artificial intelligence since last December has increased demand for high-performance DRAM, or high-bandwidth memory (HBM), capable of handling large-scale data, which can increase data capacity and speed by mor
Infineon Team Develops Biodegradable PCBs for Power Demo Boards
Aug 02, 2023
08-02
2023
Infineon Technologies is reportedly using recyclable PCB technology in its power demo boards to reduce e-waste.
Infineon High Voltage Superjunction MOSFET Series Adds Industrial and Vehicle Grade Devices for Static Switching Applications
Aug 02, 2023
08-02
2023
In static switching applications, power supply design focuses on minimizing conduction losses, optimizing thermal performance, and enabling compact and lightweight system designs while achieving high quality at low cost. To meet the needs of next-generati
Micron Introduces High Capacity High Bandwidth Memory (HBM) with Improved Performance to Enable Generative AI Innovation
Aug 02, 2023
08-02
2023
Micron Technology Inc. today announced that the company has begun sampling the industry's first 8-layer stacked, 24GB capacity, second generation HBM3 memory with more than 1.2TB/s of bandwidth and a pin rate of more than 9.2Gb/s, which can deliver up to
Dutch semiconductor equipment maker ASM: Q2 new orders down by nearly half on weak demand
Aug 01, 2023
08-01
2023
According to Reuters reported on July 26, the Netherlands semiconductor equipment maker ASM International (ASM) said that new orders in the second quarter decreased by nearly half, due to weak demand, and some customers' production facilities delayed.
Stellantis, Samsung SDI plan second U.S. battery plant
Jul 31, 2023
07-31
2023
On July 24, automaker Stellantis and South Korean battery maker Samsung SDI announced plans to open a second joint venture plant in the United States to produce batteries for electric vehicles, Reuters reported.
Taiwan media: TSMC's CoWoS production capacity will reach 240000 pieces in 2024, and Nvidia will obtain 150000 pieces at most
Jul 31, 2023
07-31
2023
According to the DigiTimes of Taiwan media, a few months ago, the rapid demand for Nvidia AI GPU led to a serious shortage of advanced packaging capacity of TSMC CoWoS. Recently, Wei Zhejia, president of TSMC, said frankly that he had previously held a co
In response to the demand for AI chips, TSMC spent NT$90 billion to build an advanced packaging plant
Jul 31, 2023
07-31
2023
It was reported that the Bamboo Administration, considering the urgency of TSMC building a factory, decided to allocate a large area of land for the gong to TSMC to build an advanced packaging plant, in order to facilitate TSMC to accelerate the expansion
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